Low Energy, Low Cost SoCs

Bluetooth Low Energy 5 / Sub-1GHz / Zigbee / AH / LORA RF Modem SOC

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(日本語) A complete RF Modem companion chip for adding Bluetooth Low Energy (BLE) v5.x (2.4GHz), Sub-1GHz (150-960MHz), 802.15.4(Zigbee), 802.11 AH and LORA capability to any embedded CPU SoC via a standard SPI interface. Integrated Bluetooth Low Energy (BLE) Link Layer and FSK, GFSK, OOK Modem enables data rates of 2Mbps for Bluetooth and 50Kbps for Sub-1GHz. Connection range from ~100 meters with Bluetooth to ~50Km over Sub-1GHz ISM band. Standard SPI interface plus chip select & packet sync pins for interfacing a MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required. Low cost & simple upgrade to any embedded MCU system.  
BLE-Sub-1GHz-Zigbee-AH-LORA-RF-Modem-SOC-provider-in-Europe
(日本語)

Key features:

  • RF Front end SoC with integrated modem: 2.4GHz - Bluetooth Low Energy  (BLE) v5.x
      Bluetooth Low Energy (BLE) v5 Link Layer Integrated, 15.4 / ZigBee
    1. 150-960MHz - Sub-1GHz ISM
    1. FSK, GFSK, OOK Modulation
    1. 15.4 & 15.4G
    1. GFSK and O-QPSK Modulation
    1. 802.11 AH
    1. LORA (Mod/Freq Compatible)
    1. Proprietary Software Defined Radio links
  • RF Tx power:
      +5dBm Bluetooth
    1. +16dBm Sub-1GHz
  • Data Rate Supported:
      2Mbps & 1Mbps (Bluetooth)
    1. 50Kbps (Sub-1GHz)
  • Bluetooth® 5 Low Energy (BLE) Certified
  • BQB Certification as a PHY component
  • Integrated functionality:
      CRC & AES-CCM HW security engine
    1. Frequency hopping
    1. Frequency offset cancellation loop
    1. Programmable channel filter bandwidth
    1. RSSI read-out
    1. 16MHz or 32MHz crystal
    1. 16MHz clock output for MCU or SOC
    1. Integrated DC/DC and LDO regulator
  • SPI interface (Tx/Rx) to MCU or SOC
  • Protocol Stack & Profiles running on companion CPU
  • Compatible with 3rd party Stacks
  • Very Low Power Consumption, Standby & Deep Sleep functions
  • PMU for power-saving states

Availability:

  • 28-pin QFN (4x4) package, MOQ: 5Kpcs
  • Known Good Die , MOQ: 1 boat / 25 wafers
  • IP for Technology Transfer
  • EVKs with Processor and SW integrated.
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