Bluetooth Low Energy 5 / Sub-1GHz / Zigbee / AH / LORA RF Modem SOC
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(日本語) A complete RF Modem companion chip for adding Bluetooth Low Energy (BLE) v5.x (2.4GHz), Sub-1GHz (150-960MHz), 802.15.4(Zigbee), 802.11 AH and LORA capability to any embedded CPU SoC via a standard SPI interface. Integrated Bluetooth Low Energy (BLE) Link Layer and FSK, GFSK, OOK Modem enables data rates of 2Mbps for Bluetooth and 50Kbps for Sub-1GHz. Connection range from ~100 meters with Bluetooth to ~50Km over Sub-1GHz ISM band.
Standard SPI interface plus chip select & packet sync pins for interfacing a MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required.
Low cost & simple upgrade to any embedded MCU system.


(日本語)
Key features:
- RF Front end SoC with integrated modem: 2.4GHz - Bluetooth Low Energy (BLE) v5.x
- Bluetooth Low Energy (BLE) v5 Link Layer Integrated, 15.4 / ZigBee
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- 150-960MHz - Sub-1GHz ISM
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- FSK, GFSK, OOK Modulation
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- 15.4 & 15.4G
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- GFSK and O-QPSK Modulation
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- 802.11 AH
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- LORA (Mod/Freq Compatible)
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- Proprietary Software Defined Radio links
- RF Tx power:
- +5dBm Bluetooth
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- +16dBm Sub-1GHz
- Data Rate Supported:
- 2Mbps & 1Mbps (Bluetooth)
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- 50Kbps (Sub-1GHz)
- Bluetooth® 5 Low Energy (BLE) Certified
- BQB Certification as a PHY component
- Integrated functionality:
- CRC & AES-CCM HW security engine
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- Frequency hopping
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- Frequency offset cancellation loop
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- Programmable channel filter bandwidth
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- RSSI read-out
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- 16MHz or 32MHz crystal
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- 16MHz clock output for MCU or SOC
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- Integrated DC/DC and LDO regulator
- SPI interface (Tx/Rx) to MCU or SOC
- Protocol Stack & Profiles running on companion CPU
- Compatible with 3rd party Stacks
- Very Low Power Consumption, Standby & Deep Sleep functions
- PMU for power-saving states
Availability:
- 28-pin QFN (4x4) package, MOQ: 5Kpcs
- Known Good Die , MOQ: 1 boat / 25 wafers
- IP for Technology Transfer
- EVKs with Processor and SW integrated.