Description and Features

A complete RF Modem companion chip for adding Bluetooth Low Energy (BLE) v5 & ZigBee (2.4GHz) capability to any embedded CPU SoC via a standard SPI interface. Integrated Bluetooth Low Energy (BLE) Link Layer enables data rates of 2Mbps for Bluetooth and connection range of ~100 meters. Standard SPI interface plus chip select & packet sync pins for interfacing to an MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required. Low cost & simple upgrade to any embedded MCU system.

Features

Key features:

• RF Front end SoC with integrated modem:
  • 2.4GHz Bluetooth Low Energy (BLE) v5
  • 2.4GHz ZigBee v3

• RF Tx power: +5dBm Bluetooth
• Data Rate Supported: 2Mbps & 1Mbps (Bluetooth)
• Bluetooth® 5 Low Energy (BLE) Certified
  • BQB Certification as a PHY component
  • Bluetooth Low Energy BLE LL integrated – HCI Interface

• Integrated functionality:
  • CRC & AES-CCM HW security engine
  • Frequency hopping
  • Frequency offset cancellation loop
  • Programmable channel filter bandwidth
  • RSSI read-out
  • 16MHz or 32MHz crystal
  • 16MHz clock output for MCU or SOC
  • Integrated DC-DC converter and LDO regulator

• SPI interface (Tx/Rx) to MCU or SOC
• Bluetooth Low Energy (BLE) v5.1 Protocol Stack & Profiles running on companion MCU
• Compatible with 3rd party Stacks
• Very Low Power Consumption, Standby & Deep Sleep functions
• PMU for power-saving states

Availability:

• 28-pin QFN (4x4) package, MOQ: 5Kpcs
• Known Good Die, MOQ: 1 boat / 25 wafers
• IP for Technology Transfer