Description and Features

(日本語) A complete RF Modem companion chip for adding Bluetooth Low Energy (BLE) v5.x (2.4GHz), Sub-1GHz (150-960MHz), 802.15.4(Zigbee), 802.11 AH and LORA capability to any embedded CPU SoC via a standard SPI interface. Integrated Bluetooth Low Energy (BLE) Link Layer and FSK, GFSK, OOK Modem enables data rates of 2Mbps for Bluetooth and 50Kbps for Sub-1GHz. Connection range from ~100 meters with Bluetooth to ~50Km over Sub-1GHz ISM band. Standard SPI interface plus chip select & packet sync pins for interfacing a MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required. Low cost & simple upgrade to any embedded MCU system.  

 

Features

Key features:

• RF Front end SoC with integrated modem: 2.4GHz - Bluetooth Low Energy  (BLE) v5.x
  • Bluetooth Low Energy (BLE) v5 Link Layer Integrated, 15.4 / ZigBee
  • 150-960MHz - Sub-1GHz ISM
  • FSK, GFSK, OOK Modulation
  • 15.4 & 15.4G
  • GFSK and O-QPSK Modulation
  • 802.11 AH
  • LORA (Mod/Freq Compatible)
  • Proprietary Software Defined Radio links

• RF Tx power:
  • +5dBm Bluetooth
  • +16dBm Sub-1GHz

• Data Rate Supported:
  • 2Mbps & 1Mbps (Bluetooth)
  • 50Kbps (Sub-1GHz)

• Bluetooth® 5 Low Energy (BLE) Certified
• BQB Certification as a PHY component
• Integrated functionality:
  • CRC & AES-CCM HW security engine
  • Frequency hopping
  • Frequency offset cancellation loop
  • Programmable channel filter bandwidth
  • RSSI read-out
  • 16MHz or 32MHz crystal
  • 16MHz clock output for MCU or SOC
  • Integrated DC/DC and LDO regulator

• SPI interface (Tx/Rx) to MCU or SOC
• Protocol Stack & Profiles running on companion CPU
• Compatible with 3rd party Stacks
• Very Low Power Consumption, Standby & Deep Sleep functions
• PMU for power-saving states

Availability:

• 28-pin QFN (4x4) package, MOQ: 5Kpcs
• Known Good Die , MOQ: 1 boat / 25 wafers
• IP for Technology Transfer
• EVKs with Processor and SW integrated