Production Proven, Complex Semiconductor IP Cores

Low Energy, Low Cost SoCs

T2M Sub-1 Ghz Bluetooth Low Energy 5 / Sub-1GHz / Zigbee / AH / LORA RF Modem SOC

Bluetooth Low Energy 5 / Sub-1GHz / Zigbee / AH / LORA RF Modem SOC

Description and Features

(日本語) A complete RF Modem companion chip for adding Bluetooth Low Energy (BLE) v5.x (2.4GHz), Sub-1GHz (150-960MHz), 802.15.4(Zigbee)802.11 AH and LORA capability to any embedded CPU SoC via a standard SPI interface. Integrated Bluetooth Low Energy (BLE) Link Layer and FSK, GFSK, OOK Modem enables data rates of 2Mbps for Bluetooth and 50Kbps for Sub-1GHz. Connection range from ~100 meters with Bluetooth to ~50Km over Sub-1GHz ISM band. Standard SPI interface plus chip select & packet sync pins for interfacing a MCU or SOC and accessing an integrated AES engine for data encryption/decryption. No external RAM, ROM or Flash is not required. Low cost & simple upgrade to any embedded MCU system.  




Key features:

  • RF Front end SoC with integrated modem: 2.4GHz - Bluetooth Low Energy  (BLE) v5.x
    • Bluetooth Low Energy (BLE) v5 Link Layer Integrated, 15.4 / ZigBee
    • 150-960MHz - Sub-1GHz ISM
    • FSK, GFSK, OOK Modulation
    • 15.4 & 15.4G
    • GFSK and O-QPSK Modulation
    • 802.11 AH
    • LORA (Mod/Freq Compatible)
    • Proprietary Software Defined Radio links
  • RF Tx power:
    • +5dBm Bluetooth
    • +16dBm Sub-1GHz
  • Data Rate Supported:
    • 2Mbps & 1Mbps (Bluetooth)
    • 50Kbps (Sub-1GHz)
  • Bluetooth® 5 Low Energy (BLE) Certified
  • BQB Certification as a PHY component
  • Integrated functionality:
    • CRC & AES-CCM HW security engine
    • Frequency hopping
    • Frequency offset cancellation loop
    • Programmable channel filter bandwidth
    • RSSI read-out
    • 16MHz or 32MHz crystal
    • 16MHz clock output for MCU or SOC
    • Integrated DC/DC and LDO regulator
  • SPI interface (Tx/Rx) to MCU or SOC
  • Protocol Stack & Profiles running on companion CPU
  • Compatible with 3rd party Stacks
  • Very Low Power Consumption, Standby & Deep Sleep functions
  • PMU for power-saving states


  • 28-pin QFN (4x4) package, MOQ: 5Kpcs
  • Known Good Die , MOQ: 1 boat / 25 wafers
  • IP for Technology Transfer
  • EVKs with Processor and SW integrated