Press Releases

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

LAS VEGAS, Jan. 6, 2020 /PRNewswire/ -- Tempow, creators of software-only solutions to enhance core Bluetooth protocol, today announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation of Bluetooth audio. It is also opening an exclusive partnership program for chipset manufacturers to use Tempow's implementation.

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T2M and Mindtree to showcase cutting-edge BQB-qualified Mesh SW and Bluetooth 5 IP at Bluetooth Asia, Shenzhen

Munich, May 16, 2018 – T2M, the world’s largest independent global semiconductor technology provider today announced that, Mindtree, will be showcasing their customer proven BQB-qualified Bluetooth Mesh v1.0 software and Bluetooth Low Energy 5.0 Modem, Digital Link Layer, Protocol Stack SW and Profiles IP at Bluetooth Asia 2018 on 30, 31 May at Shenzhen Convention & Exhibition Centre, Booth #34.

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