BLE Modules
BLE Modules BLE Modules

Smarter Connectivity. Ultra-Low Power.

Powering the next generation of connected devices with compact, energy-efficient Bluetooth Low Energy modules. Designed for reliable wireless performance, seamless integration, and extended battery life, enabling smarter solutions across Wearables, Smart Home, Healthcare, Asset Tracking, and Industrial IoT.

T2M3219-M

General Specifications

  • Supports Bluetooth LE 5.4, proprietary 2.4 GHz, IEEE 802.15.4 and Matter connectivity.
  • Powered by a 32-bit RISC-V MCU operating at 96 MHz.
  • Integrated 2 MB Flash and 128 KB SRAM.
  • Features a minimal integrated IR BOM design.
  • Supports Secure Boot and Root of Trust security.
  • Designed for low-power operation, with TX/RX current below 4 mA under specified conditions.
  • Supports FR1 PCB antenna option.
  • Listed certifications include FCC, IC, CE, TELEC, NCC, SRRC, RoHS, REACH and PSA1.
T2M3219-M

Technical Specifications

From the manufacturer documentation for ML3219D-MERCURY-M0-PA11:

  • Provides up to 24 module GPIOs.
  • Supports SPI, I²C, UART, USB, PWM and ADC peripherals.
  • Offers up to +8.4 dBm RF output power.
  • Provides −96 dBm BLE receiver sensitivity at 1 Mbps.
  • Supports BLE 2M, LE Coded PHY and PAwR.
  • Operates from 1.8–4.3 V with a 0.7 µA low-power sleep mode.
  • Compact module dimensions of 11.3 × 26 × 2.6 mm.

Key Applications

  • Smart Home & Lighting
  • Smart Remote Controls
  • Wireless Mouse & Keyboards
  • Wearable Devices
  • BLE Asset Tracking & Tags
  • Matter / Thread / Zigbee Devices

T2M322A-M

General Specifications

  • Supports Bluetooth LE 5.4, proprietary 2.4 GHz, IEEE 802.15.4 and Matter connectivity.
  • Powered by dual 32-bit RISC-V cores operating at up to 192 MHz.
  • Integrates 2.5 MB NVM and 384 KB SRAM.
  • Supports Telink HDT wireless technology with data rates up to 6 Mbps.
  • Features High-Speed USB, I3C, CAN-FD and other peripheral interfaces.
  • Includes Secure Boot and Root of Trust security features.
  • Designed for low-power wireless operation, with TX/RX current below 4.5 mA under specified conditions.
  • Supports an FR1 PCB antenna option.
  • Lists FCC, IC, CE, TELEC, NCC, SRRC, RoHS, REACH and ESD (+2 kV) certifications/compliance.

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Key Features

  • High-performance dual-core RISC-V architecture.
  • Ultra-low-latency 2.4 GHz wireless connectivity.
  • High-speed HDT communication up to 6 Mbps.
  • Integrated security for connected devices.
  • Flexible interfaces for advanced wireless peripherals.

Potential Applications

  • Wireless Gaming Mouse & Keyboards
  • Gaming Controllers & Gamepads
  • Wireless HID Devices
  • Smart Home & Lighting
  • Smart Remote Controls
  • Industrial IoT Devices

T2M7218 – M

General Specifications

  • Supports Bluetooth LE 6.0, Zigbee, Thread, Matter and proprietary 2.4 GHz connectivity.
  • Powered by a 32-bit RISC-V MCU operating at up to 240 MHz.
  • Integrated 512 KB SRAM and 2 MB Flash memory.
  • Delivers RF output power up to +8.5 dBm.
  • Offers −96 dBm receiver sensitivity at BLE 1 Mbps.
  • Operates with a supply voltage of 1.8–4.3 V.
  • Provides up to 20 GPIOs for peripheral connectivity.
  • Supports 3 SPI, 2 I²C, 3 UART and 1 Full-Speed USB interface.
  • Includes 3 I²S, 7 PWM, 5 ADC, 1 AMIC and 2 DMIC interfaces.
  • Compact module dimensions of 11.3 × 26 × 2.6 mm.
T2M7218 – M

Key Features

  • Multi-protocol Bluetooth LE, Zigbee, Thread & Matter support
  • Bluetooth LE 2M, LE Coded PHY and Channel Sounding
  • High-performance 240 MHz RISC-V MCU with DSP extensions
  • Ultra-low-power operation, sleep current as low as 1 µA without SRAM retention
  • BLE RX: 2.4 mA / TX: 3.5 mA at 3.3 V DCDC mode
  • Secure Boot, secure OTA and hardware cryptography
  • PTA support for Wi-Fi coexistence
  • Compact form factor with integrated antenna

Applications

  • Smart Home & Lighting
  • Smart Remote Controls
  • Wireless Mouse & Keyboards
  • Wearable Devices
  • Asset Tracking & BLE Tags
  • Matter / Thread / Zigbee Sensors

Product Specifications

Product Selection Tool
Part No. Protocol MCU-MHz SRAM (KB) Flash (KB) SPI I2C I2S GPIO UART USB ADC Voltage PKG NODE

T2M7218A-M

General Specifications

  • Supports Bluetooth LE 6.0, Zigbee, Thread, Matter and proprietary 2.4 GHz connectivity.
  • Powered by a 32-bit RISC-V MCU operating at up to 240 MHz.
  • Integrated 512 KB SRAM and 2 MB Flash memory.
  • Delivers RF output power up to +9 dBm.
  • Offers −96 dBm receiver sensitivity at BLE 1 Mbps.
  • Operates with a supply voltage of 1.8–4.3 V.
  • Provides up to 48 GPIOs for peripheral connectivity.
  • Supports 3 SPI, 2 I²C, 2 UART, 1 Full-Speed USB and Debug interface.
  • Includes 3 I²S, 7 PWM, 10 ADC, 1 AMIC and 2 DMIC interfaces.
  • Module dimensions of 18 × 35.29 × 2.6 mm.
T2M7218A-M

Key Features

  • Multi-protocol Bluetooth LE, Zigbee, Thread & Matter support
  • Bluetooth LE 2M, LE Coded PHY and Channel Sounding
  • High-performance 240 MHz RISC-V MCU with DSP extensions
  • Up to 48 GPIOs for extensive peripheral connectivity
  • Ultra-low-power operation, sleep current as low as 1 µA without SRAM retention
  • BLE RX: 2.6 mA / TX: 2.8 mA at 3.3 V DCDC mode
  • Secure Boot, secure OTA and hardware cryptography
  • PTA support for Wi-Fi coexistence

Applications

  • Smart Home & Building Automation
  • Smart Lighting & Wireless Switches
  • Matter / Thread / Zigbee Gateways
  • Smart Remote Controls
  • Wireless HID Devices
  • Industrial IoT & Sensor Devices
  • Wearables & Asset Tracking

Product Specifications

Product Selection Tool
Part No. Protocol MCU-MHz SRAM (KB) Flash (KB) SPI I2C I2S GPIO UART USB ADC Voltage PKG NODE

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Series Supplier Part No. Protocol MCU-MHz SRAM (KB) Flash (KB) SPI I2C GPIO USB ADC Datasheet
T2M7218 – M N/A
T2M7218A-M N/A