Audio SoC for Smart Audio Devices

Enable premium wireless audio experiences with highly integrated Bluetooth Audio SoCs designed for TWS earbuds, open-ear earbuds, smart glasses, wireless headsets, neckbands, and next-generation hearables. These advanced audio platforms combine ultra-low power wireless connectivity, high-performance audio processing, and AI-driven intelligence to help manufacturers develop feature-rich smart audio products with faster time-to-market.

For Wi-Fi-enabled smart audio applications, the portfolio also includes the T2M5010, a highly integrated Wi-Fi 6 + BT/BLE 7.0 SoC featuring dual RISC-V processors, advanced wireless connectivity, and low-power operation. It is ideal for Wi-Fi speakers, AI voice Recorder, Wireless Microphone, AI Glass, and connected smart home audio devices, enabling seamless cloud connectivity alongside high-quality wireless audio.

Powered by advanced audio architecture, these Audio SoCs deliver exceptional sound quality while maintaining industry-leading power efficiency. Key features include:

1. Cadence® HiFi 5 DSP for high-performance audio processing
2. Integrated NPU for AI-powered audio applications
3. Hybrid ANC (Active Noise Cancellation) for immersive listening experiences
4. Multi-Mic ENC (Environmental Noise Cancellation) for crystal-clear voice calls
5. Voice Wake-Up & Keyword Spotting for intelligent voice interaction
6. Spatial Audio Support for enhanced audio immersion
7. Bluetooth, LE Audio, LC3 & LC3+ Ready for next-generation wireless connectivity
8. Wi-Fi 6 + BT /BLE 7.0 dual protocol stacks for cloud-connected smart audio devices
9. Ultra-Low Power Architecture for extended battery life

Designed for modern wearable and connected audio devices, the platform supports multi-microphone processing, AI-enhanced call quality, low-latency Bluetooth audio streaming, and high-speed Wi-Fi connectivity where required. Advanced audio algorithms improve voice clarity and listening performance, while ultra-low power operation extends battery life in compact, battery-powered products.

The highly integrated architecture reduces system complexity and BOM costs while providing a flexible software ecosystem for rapid product development. With support for TWS Audio Solutions, Open-Ear Audio Devices, Smart Glasses, Wireless Headsets, Neckbands, AI-Powered Hearables, Smart Speakers, Smart Displays, and Wi-Fi Audio Devices, these Audio SoCs enable manufacturers to create differentiated products that deliver superior audio quality, intelligent voice interaction, seamless Bluetooth connectivity, and high-performance Wi-Fi networking.