Audio SoC for Smart Audio Devices

Enable premium wireless audio experiences with highly integrated Bluetooth Audio SoCs designed for TWS earbuds, open-ear earbuds, smart glasses, wireless headsets, Neckbands, and next-generation hearables. These advanced audio platforms combine ultra-low power wireless connectivity, high-performance audio processing, and AI-driven intelligence to help manufacturers develop feature-rich smart audio products with faster time-to-market.

Powered by advanced audio architecture, these Audio SoCs deliver exceptional sound quality while maintaining industry-leading power efficiency. Key features include:

1. Cadence® HiFi 5 DSP (open) + RISC-V CPU for high-performance audio processing
2. Integrated NPU for AI-powered audio applications
3. Hybrid ANC (Active Noise Cancellation) for immersive listening experiences
4. Multi-Mic ENC (Environmental Noise Cancellation) for crystal-clear voice calls
5. Voice Wake-Up & Keyword Spotting for intelligent voice interaction
6. Spatial Audio Support for enhanced audio immersion
7. Bluetooth, LE Audio, LC3, LC3+ Ready for next-generation wireless connectivity
8. Ultra-Low Power Architecture for extended battery life

Designed for modern wearable and hearable devices, the platform supports multi-microphone processing, AI-enhanced call quality, and low-latency Bluetooth audio streaming. Advanced audio algorithms improve voice clarity and listening performance, while ultra-low power operation extends battery life in compact, battery-powered devices.

The highly integrated architecture reduces system complexity and BOM costs while providing a flexible software ecosystem for rapid product development. With support for TWS Audio Solutions, Open-Ear Audio Devices, Smart Glasses, Wireless Headsets, and AI-Powered Hearables, these Audio SoCs enable manufacturers to create differentiated products that deliver superior audio quality, intelligent voice interaction, and seamless wireless connectivity.